Capacity&Delivery Capacity
| Monthly Capacity | 50000㎡ | |
| Type | Sample Order | Batch Order |
|---|---|---|
| Single&Double-sided Boards | 3-5days | 6-8days |
| Four-Layers | 5-7days | 8-10day |
| Six-Layers | 7-8days | 10-12days |
| The above delivery time is the factory manufacturing time, excluding transportation time. | ||
Process Capability
| SN | Item | Technical Parameter |
|---|---|---|
| 1 | Number Of Layers | 1-10（Layers） |
| 2 | Finished Board Size (Maximum) | 24.8” x 30” (630 x 760mm) |
| 3 | Board Thickness | 0.0078”-0.126” (0.4-3.2mm) |
| 4 | Thickness Tolerance Of Finished Product | ±10% ±3mil（Board thickness ≤0.8mm） |
| 5 | Plate Bending (Minimum) | ≤0.50% |
| 6 | Borehole Diameter | 0.008”-0.255” (0.20-6.5mm) |
| 7 | Thickness Of Outer Bottom Copper | 1/3oz-8oz |
| 8 | Thickness Of Inner Bottom Copper | 1/2oz-3oz |
| 9 | Board Type | FR-4（tg130℃~tg210℃)etc |
| 10 | Transverse Ratio Of Hole Electroplating (Maximum) | 10:1 |
| 11 | Aperture tolerance (plated through hole) | ±3mil（±0.075mm） |
| 12 | Aperture tolerance (non-through hole) | ±1mil（±0.025mm） |
| 13 | Copper thickness of hole wall | ≥0.8mil（≥0.02mm） |
| 14 | Inner layer design line width/spacing(Minimum) | H/Hoz 3.0/3.0mil (0.07 /0.075mm) 1/1oz 4mil/4mil (0.1016mm/0.1016mm) 2/2oz 5mil/5mil (0.127mm/0.127mm) 3/3oz 6mil/6mil (0.152mm/0.152mm) |
| 15 | Outer layer design line width/spacing(Minimum) | T/Toz 2.5/2.5mil (0.0625/0.0625mm) H/Hoz 3/3mil (0.075/0.075mm) 1/1oz 4/4.4mil (0.10mm/0.10m) 2/2oz 6mil/6mil (0.152mm/0.152mm) 3/3oz 7mil/7mil (0.152mm/0.152mm) |
| 16 | Width of solder resist bridge(minimum) | ≧3mil（0.076mm） |
| 17 | Shape tolerance (hole to edge)(Minimum) | Limit ±3mil (±0.076mm） |
| 18 | Hot Impact | 288°C 10s（3 times） |
| 19 | Peel Strength | ≥1.4N／mm |
| 20 | Characteristic Impedance Control | ±8% |
| 21 | Solder Resist Strength | 6H |
| 22 | Surface Treatment Process | OSP、HAL Lead-Free、Immersion Glod、Immersion tin、Immersion silver etc |
| 23 | Lon Contamination Test | 1.56ug／cm2(NaCI) |